Merkmale
Self-Encrypting Drive (SED), DMA unterstützt, TRIM-Unterstützung, Secure Erase-Funktion, Active Garbage Collection, Enterprise Data Path Protection, Datenschutz bei Stromausfall, Digitally Signed Firmware, Firmware Upgrade without Reset, Secure Boot, Secure Firmware, 176-Layer 3D TLC NAND Technologie, NAND Block Erase, Cryptographic Erase