Merkmale
3D NAND Technology, CMOS-under-Array (CuA), Data Path Protection, Stromausfallschutz (SAS), NVM Express (NVMe) 1.4, 176-lagige NAND-Technologie, Read Intensive, Secure Boot, Secure Execution Environment, Asymmetric Roots of Trust, Strong Asymmetric Key Support, RSA Delegation Key Support, Key-basiertes Firmware-Update, Key-basierter privilegierter Zugang, non-SED