Merkmale
Enhanced Power Loss Data Protection, thermische Drosselung, End-to-End-Datenschutz, 3D NAND Technology, Thermal Monitoring, ultra-low I/O latency
Entwickelt für
ThinkSystem SD530 7X21 (2.5"); SD630 V2 7D1K (2.5"); SN550 7X16 (2.5"); SN550 V2 7Z69 (2.5"); SN850 7X15 (2.5"); SR570 7Y02 (2.5"), 7Y03 (2.5"); SR590 7X98 (2.5"), 7X99 (2.5"); SR630 7X01 (2.5"), 7X02 (2.5"); SR630 V2 7Z70 (2.5"), 7Z71 (2.5"); SR645 7D2X (2.5"), 7D2Y (2.5"); SR650 7X05 (2.5"), 7X06 (2.5"); SR650 V2 7Z72 (2.5"), 7Z73 (2.5"); SR655 7Y00 (2.5"), 7Z01 (2.5"); SR665 7D2V (2.5"), 7D2W (2.5"); SR670 V2 7Z22 (2.5"), 7Z23 (2.5"); SR850 7X18 (2.5"), 7X19 (2.5"); SR850 V2 7D31 (2.5"), 7D32 (2.5"); SR850P 7D2F (2.5"); SR860 7X69 (2.5"), 7X70 (2.5"); SR860 V2 7Z59 (2.5"), 7Z60 (2.5"); SR950 7X11 (2.5"), 7X12 (2.5"); ST650 V2 7Z74 (2.5"), 7Z75 (2.5")
